JPS626705Y2 - - Google Patents

Info

Publication number
JPS626705Y2
JPS626705Y2 JP1979102900U JP10290079U JPS626705Y2 JP S626705 Y2 JPS626705 Y2 JP S626705Y2 JP 1979102900 U JP1979102900 U JP 1979102900U JP 10290079 U JP10290079 U JP 10290079U JP S626705 Y2 JPS626705 Y2 JP S626705Y2
Authority
JP
Japan
Prior art keywords
light
resin
receiving element
recess
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1979102900U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5621465U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979102900U priority Critical patent/JPS626705Y2/ja
Publication of JPS5621465U publication Critical patent/JPS5621465U/ja
Application granted granted Critical
Publication of JPS626705Y2 publication Critical patent/JPS626705Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP1979102900U 1979-07-25 1979-07-25 Expired JPS626705Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979102900U JPS626705Y2 (en]) 1979-07-25 1979-07-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979102900U JPS626705Y2 (en]) 1979-07-25 1979-07-25

Publications (2)

Publication Number Publication Date
JPS5621465U JPS5621465U (en]) 1981-02-25
JPS626705Y2 true JPS626705Y2 (en]) 1987-02-16

Family

ID=29335612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979102900U Expired JPS626705Y2 (en]) 1979-07-25 1979-07-25

Country Status (1)

Country Link
JP (1) JPS626705Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234456Y2 (en]) * 1980-03-03 1987-09-02

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5337585U (en]) * 1976-09-06 1978-04-01
JPS5333436A (en) * 1976-09-09 1978-03-29 Toshiba Corp Alloy for high frequency induction heating vessel
US4152713A (en) * 1977-12-05 1979-05-01 Bell Telephone Laboratories, Incorporated Unidirectional optical device and regenerator

Also Published As

Publication number Publication date
JPS5621465U (en]) 1981-02-25

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